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[1]吴海银,韩宝军,俞娟,等.聚酰亚胺泡沫材料制备工艺研究[J].南京工业大学学报(自然科学版),2020,42(02):195-199.[doi:10.3969/j.issn.1671-7627.2020.02.009]
　WU Haiyin,HAN Baojun,YU Juan,et al.Investigation of polyimide foam from pyromellitic anhydride and 4,4’-diaminodiphenyl ether[J].Journal of NANJING TECH UNIVERSITY(NATURAL SCIENCE EDITION),2020,42(02):195-199.[doi:10.3969/j.issn.1671-7627.2020.02.009]
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聚酰亚胺泡沫材料制备工艺研究()
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《南京工业大学学报（自然科学版）》[ISSN:1671-7627/CN:32-1670/N]

卷:
42
期数:
2020年02期
页码:
195-199
栏目:
出版日期:
2020-03-22

文章信息/Info

Title:
Investigation of polyimide foam from pyromellitic anhydride and 4,4’-diaminodiphenyl ether
文章编号:
1671-7627(2020)02-0195-05
作者:
吴海银1; 韩宝军1; 俞娟2; 王晓东1; 2; 黄培1; 2
1.南京工业大学 化工学院 材料化学工程国家重点实验室,江苏 南京 211800; 2.南京工业大学 先进聚合物材料研究所,江苏 南京 211800
Author(s):
WU Haiyin1;  HAN Baojun1;  YU Juan2;  WANG Xiaodong1; 2;  HUANG Pei1; 2
1.State Key Laboratory of Materials-Oriented Chemical Engineering, College of Chemical Engineering, Nanjing Tech University, Nanjing 211800,China; 2. Institute of Advanced Polymer Materials, Nanjing Tech University, Nanjing 211800, China
关键词:
聚酰亚胺泡沫;  溶剂萃取;  导热性能;  热稳定性;  热亚胺化
Keywords:
polyimide foam;  solvent extraction;  thermal conductivity;  thermal stability;  thermal imidization
分类号:
TQ328
DOI:
10.3969/j.issn.1671-7627.2020.02.009
文献标志码:
A
摘要:
采用两步法合成聚酰亚胺(PI)泡沫,考察3种去除N,N-二甲基乙酰胺(DMAc)溶剂的工艺对PI泡沫性能的影响。以均苯四甲酸酐(PMDA)和4,4’-二氨基二苯醚(ODA)为原料,在DMAc中合成聚酰胺酸(PAA)溶液,用边加水边超声、加水后超声和加水后静置的3种工艺萃取溶剂,最后经高温热亚胺化法制备得到PI泡沫。采用傅里叶红外光谱仪(FT-IR)、扫描电子显微镜(SEM)、比表面积测试仪、导热系数测试仪、静态热分析仪等考察样品的结构和性能。结果表明:超声处理的泡沫内部主要以层状的网络结构为主,而静置工艺的泡沫内部可见明显孔洞(孔径5～20 μm); 两种超声工艺制备得到的泡沫导热系数为0.08～0.09 W/(m·K); 3种泡沫具有相似的热分解温度和玻璃化转变温度,热分解5%的温度为552～568 ℃,玻璃化转变温度为325～328 ℃。因此,PI泡沫具有较好的耐热性。
Abstract:
Polyimide(PI)foam was synthesized by two-step method. Polyamide acid(PAA)solution was synthesized in N,N-dimethyl acetamide(DMAc)with pyromellitic anhydride(PMDA)and 4,4’-diaminodiphenyl ether(ODA). Water was added into the PAA solution by three ways: adding water with ultrasonic treating the mixture, adding water then ultrasonic, and adding water without stirring. PI foam was formed at more high temperature. The properties of the PI foam were characterized by Fourier infrared spectrometer(FT-IR), scanning electron microscope(SEM), nitrogen adsorption for microstructure, thermal conductivity tester and static thermogravimetric analyzer. Results showed that the foam with ultrasonic was mainly composed of a layered network structure, while the pore size of the PI foam without stiring way was in range of 5-20 μm. The thermal conductivity of the foam with ultrasonic was 0.08-0.09 W/(m·K). For those foams, the decomposition temperature of decomposition rate of 5% was 552-568 ℃, and glass transition temperature was 325-328 ℃, and showed thermal stability.

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备注/Memo

备注/Memo:
收稿日期:2019-02-25
作者简介:吴海银(1993—),女,E-mail:15105176295@163.com; 黄培(联系人),教授,E-mail:phuang@njtech.edu.cn.
引用格式:吴海银,韩宝军,俞娟,等.聚酰亚胺泡沫材料制备工艺研究[J].南京工业大学学报(自然科学版),2020,42(2):195-199.
WU Haiyin, HAN Baojun, YU Juan, et al. Investigation of polyimide foam from pyromellitic anhydride and 4,4’-diaminodiphenyl ether[J].Journal of Nanjing Tech University(Natural Science Edition),2020,42(2):195-199..
更新日期/Last Update: 2020-03-20